Special Reports

Chiplets Still A Challenge With UCIe 2.0

By: Brian Bailey

New connectivity standard brings performance improvements and a bunch of new features, but it may take years before they are...
Global IC Fabs And Facilities Report: 2024

By: Liz Allan

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with...
What’s The Best Way To Sell An Inference Engine?

By: Bryon Moyer

The hardware choices for AI inference engines are chips, chiplets, and IP. Multiple considerations must be weighed.

 more »

Top Stories

Universities Augment Engineering Curricula To Boost Employability

Companies need engineers across all disciplines and universities are stepping up to del...

AI In Data Management Has Limits

Trusting which data to use and what can be deleted still requires human oversight; star...

Chip Architectures Becoming Much More Complex With Chiplets

Options for how to build systems increase, but so do integration issues.

Design Customization Puts Heavy Burden On Verification

Configurability causes an explosion in verification complexity, but the upside is verif...

Advanced Packaging Moving At Breakneck Pace

A chiplet supermarket is still years off, but progress is being made on all fronts.

Assembly Design Rules Slowly Emerge

Assembly design kits will greatly increase efficiency, but custom methods prevail for now.

Electrifying Everything: Power Moves Toward ICs

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal an...

Upcoming Challenges And Changes In Semiconductor Materials

Brewer Science's new co-CEOs talk about shifts in materials for IC manufacturing, flexi...

Improving GaN Device Architectures

Novel combinations show promise for different applications.

Automotive OEMs Face Multiple Technology Adoption Challenges

The path to fully autonomous vehicles may be clear in concept, but fully realizing that...

Power Budgets Optimized By Managing Glitch Power

While not a focus until now, earlier readings can be made in design to better understan...

2025: So Many Possibilities

This will be an incredible year for innovation, driven by AI and for AI, and pushing th...

more top stories »

Latest News

Blog Review: Feb. 5

CXL extended metadata; comprehensive digital twins; interconnect monitoring; RFIC simulation.

Chip Industry Week In Review

DeepSeek reactions; Intel, Samsung and other chip earnings; tariff plans; R&D tax credit; GaN predictions; Apple vulnerabilities; Synaptics, Broadcom deal; LPDDR6...

more news »



Opinion

Chiplets: Where Are We Today?

The use of chiplet-based designs is expected to expand beyond ...

What’s Missing From Predictions

Predictions should not reflect innovation or breakthroughs. Th...

more opinions »



Research

Research Bits: Feb. 4

Diamond: High-power transistors; direct bonding; speedy wafer ...

Chip Industry Technical Paper Roundup: Feb. 4

Mixed-precision DL inference; CXL memory pooling; processing-u...

Research Bits: Jan. 28

Memory: Programmable photonic latch; gradient computing with m...

more research »



Startup Corner

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

more startups »

Videos

Using AI In Semiconductor Inspection


PCIe Over Optics


The Road To Super Chips


Livelocks And Deadlocks In NoCs


Knowledge Centers / Entities, people and technologies explored