Special Reports

Hybrid Bonding Makes Strides Toward Manufacturability

By: Laura Peters

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.
Mass Customization For AI Inference

By: Ann Mutschler

The number of approaches to process AI inferencing is widening to deal with unique applications and larger and more complex...
Signals In The Noise: Tackling High-Frequency IC Test

By: Gregory Haley

Millimeter-wave frequencies require new test approaches and equipment; balancing precision with cost-efficiency is the challenge.

 more »

Top Stories

Big Changes Ahead For Analog Design

 In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, b...
November 6th, 2024 By Ed Sperling

EMEA Investments Driving Technology Specialization

 Semiconductor policies, funding, and competitions are enabling industry and academia to...
November 4th, 2024 By Liz Allan

Chiplets Make Progress Using Interconnects As Glue

 Industry learning expands as more SoCs are disaggregated at leading edge, opening door ...
October 31st, 2024 By Ann Mutschler

HW and SW Architecture Approaches For Running AI Models

 Custom hardware tailored to specific models can unlock performance gains and energy sav...
October 31st, 2024 By Karen Heyman

RISC-V Conformance

 Finding out if a processor implementation matches the specification is important, but c...
October 31st, 2024 By Brian Bailey

2D Semiconductors Make Progress, But So Does Silicon

 Can 2D materials be fabricated consistently at a cost that competes with silicon?
October 30th, 2024 By Katherine Derbyshire

Advanced Packaging Driving New Collaboration Across Supply Chain

 Rising complexity is changing the way companies engage and interact, but long-standing ...
October 24th, 2024 By Gregory Haley

New Approaches To Power Decoupling

 Strategic placement of decoupling capacitors and regulators is critical to keeping powe...
October 24th, 2024 By Bryon Moyer

Monolithic Vs. Heterogeneous Integration

 New processes, materials, and combinations of existing technologies will determine futu...
October 24th, 2024 By Ed Sperling

Americas Chip Funding Energizes Industry

 Massive government infusions aim to improve security and supply chain robustness.
October 23rd, 2024 By Liz Allan

LLMs Show Promise In Secure IC Design

 Large language models can identify and plug vulnerabilities, but they also may open new...
October 21st, 2024 By Adam Kovac

How Big A Deal Is Aging?

 Aging must be understood, analyzed, and mastered. Until then, additional margins are th...
October 17th, 2024 By Brian Bailey

more top stories »

Latest News

Blog Review: Nov. 6

 Deferrable memory write; MRAM & RRAM; 3D-IC multiphysics collaboration; aero & defense sensing; EDA basics.
November 6th, 2024 By Jesse Allen

Chip Industry Week In Review

 Silicon Valley design center and NY EUV Accelerator; Siemens' big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si...
November 1st, 2024 By The SE Staff

more news »



Opinion

Reactionary Or Anticipatory?

 Is EDA meant to react to the needs of the industry, or anticip...
October 21st, 2024 By Brian Bailey

TSMC’s Plan For Closing The Communication Gap

 COUPE For optical interconnect drives better performance and e...
October 3rd, 2024 By Barry Pangrle

Research

Chip Industry Technical Paper Roundup: Nov. 5

 Multi-chiplet accelerators; photoresists for EUV; STT-MRAM; FP...
By Linda Christensen

Research Bits: Nov. 5

 Optical computing: In-memory processing; diffraction casting; ...
By Jesse Allen

Chip Industry Technical Paper Roundup: Oct. 29

 Chiplet-compatible RISC-V; HI for HPC; photonic in-memory comp...
By Linda Christensen

more research »



Startup Corner

Startup Funding: Q3 2024

 New startups emerge from stealth; 75 companies raise $2 billion.
By Jesse Allen

Startup Funding: Q2 2024

 Big rounds for AI chips; 91 startups raise $2.6 billion.
By Jesse Allen

more startups »

Videos

Globally Asynchronous, Locally Synchronous Clocks

November 4th, 2024

Big Changes In Optical Inspection

October 16th, 2024

Working With Chiplets

October 2nd, 2024

Data Routing In Heterogeneous Chip Designs

September 30th, 2024

Knowledge Centers / Entities, people and technologies explored

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