Special Reports

Mass Customization For AI Inference

By: Ann Mutschler

The number of approaches to process AI inferencing is widening to deal with unique applications and larger and more complex...
Signals In The Noise: Tackling High-Frequency IC Test

By: Gregory Haley

Millimeter-wave frequencies require new test approaches and equipment; balancing precision with cost-efficiency is the challenge.
Government Chip Funding Spreads Globally

By: Liz Allan

Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.

 more »

Top Stories

How Big A Deal Is Aging?

 Aging must be understood, analyzed, and mastered. Until then, additional margins are th...
October 17th, 2024 By Brian Bailey

Unbundling Analog From Digital Where It Makes Sense

 The shift toward heterogeneous integration and advanced packaging have changed the dyna...
October 17th, 2024 By Ed Sperling

Startup Funding: Q3 2024

 New startups emerge from stealth; 75 companies raise $2 billion.
October 16th, 2024 By Jesse Allen

Metrology Advances Step Up To Sub-2nm Device Node Needs

 Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging a...
October 15th, 2024 By Laura Peters

New Challenges In IC Reliability

 How advanced packaging, denser circuits, and safety-critical markets are altering chip ...
October 15th, 2024 By Ed Sperling

Security Concerns Weigh Down Open-Source EDA

 Issues vary by application and how and where it's used, but many tools already contain ...
October 10th, 2024 By Adam Kovac

Challenges In Reducing Wireless Latency

 New protocols and technology will spur a whole new wave of chips, but those designs wil...
October 10th, 2024 By Karen Heyman

Managing Legacy In Automotive

 As vehicle technology evolves, carmakers must decide which technologies move forward an...
October 10th, 2024 By Ann Mutschler

The Cost Of EDA Data Storage And Processing Efficiency

 Sustainability in the EDA process is less about the environment and more about preservi...
October 9th, 2024 By Adam Kovac

Preparing For Ferroelectric Devices

 Managing crystal structure for ferroelectric performance.
October 2nd, 2024 By Katherine Derbyshire

Barriers To Chiplet Sockets

 Perfection sometimes stands in the way of progress, and there is evidence this may be h...
September 30th, 2024 By Brian Bailey

Using AI To Glue Disparate IC Ecosystem Data

 Why the chip industry is so focused on large language models for designing and manufact...
September 26th, 2024 By Ed Sperling and Ann Mutschler

more top stories »

Latest News

Chip Industry Week In Review

 Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; A...
October 11th, 2024 By The SE Staff

Blog Review: Oct. 9

 ECAD-MCAD collaboration; AXI4 locking mechanism; SRAM PUF; ADAS challenges; gate resistance; Gemini AI’s network comms.
October 9th, 2024 By Liz Allan

more news »



Research

Chip Industry Technical Paper Roundup: Oct. 14

 High NA-EUV resolution; HKMG DRAM reliability; rethinking prog...
By Linda Christensen

Research Bits: Oct. 14

 Si-photonics chip emits beam of light; towards piezoelectric c...
By Liz Allan

Research Bits: Oct. 8

 Materials: Soft, flexible polymer semiconductors; photonic top...
By Liz Allan

more research »



Startup Corner

Startup Funding: Q3 2024

 New startups emerge from stealth; 75 companies raise $2 billion.
By Jesse Allen

Startup Funding: Q2 2024

 Big rounds for AI chips; 91 startups raise $2.6 billion.
By Jesse Allen

more startups »

Videos

Big Changes In Optical Inspection

October 16th, 2024

Working With Chiplets

October 2nd, 2024

Data Routing In Heterogeneous Chip Designs

September 30th, 2024

Emerging Technologies Driving Heterogeneous Integration

September 24th, 2024

Knowledge Centers / Entities, people and technologies explored

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy